Test system

Test item

Missed,wrong place,wrong part,polarity reversed,crack,polluted,less solder,excess solder,short circuit,cold solder

Test component

0402 chip ,IC pin(0.3mm pitch), wave solder

Test Method

Full color image statistic analysis,OCR,IC Bridge analysis,color linearanalysis color non-linear analysis,similarity analysis,black-white ratio analysis,intensity analysis

Optical system

Camera

Color Gigabit CCD camera 1.45m , resolution:20um, FOV:20*20MM, Speed<2000mm2/s

Light source Lens

RGB ring-multi angle LED source,digital current controllers,standard CCTV lens, DOV :2MM

Light Curtain

Auto protect device,response time<5ms

Software Function

Software Extention

Operation Level management CAD data function,double sides auto test,off-line progrem system,skip test,camera barcode auto identification,SPC statistics function,public database

Test spec.

Programming time:1-1.5hrs/1000points,use MPF technology to reach 30min/1000 points,NG rate>99%,false positive<5000PPM,Repeat accuracy <3pcs,false negative<10PPM

Mark Point

2 mark points can be configured,Muti mark points supported within multi boards,Bad Mark supported

Computer

Dual core 2.7G,DDRIII2G,500G hard disk.22" Led widescreen monitor

Mechanic System

PCB thickness

0.3--5.0mm

Component Height

30mm-- 45mm

Drive Device

Servo motor +ball screw rod +linear guide rail

Motion Speed

MAX 700 MM/S

Position Accuracy

10µm

PCB transport Guide rail

Auto precise fixture

PCB max.size 25 x25mm -- 365x455mm(special szie can be customered)

Machine SPEC.

Power

AC 220V 50-60HZ 650W,UPS1000VA uninterruptible power supply

Machine size

940*950*1280mm

Weight

450KG