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YUSH Electronic Technology Co.,Ltd.

SPI-3D In-line 3D SPI Machine for Solder Paste Inspection Machine

Classification:AOI/SPI/X RAY Machine

Model:YS-V850

Inquiry

SPI-3D In-line 3D SPI Machine for Solder Paste Inspection Machine Specifications:

Types 

Items

            Specifications


Others

Machine Dimensions

100cmx100cmx155cm

Weight

About 600 KG

Power Supply

AC220V±10%,50/60Hz,1200W

Working Environment

Temperature: 10-40℃,Humidity: 30-80%RH

Control system

Computer

Industrial computer:Intel 4 core/8G DDR/500G HD

Display Output

19 inch LCD

Hardware

PCB Transmit System

Bottom-up fix; Auto transmit and width correct based on SMEMA;

Height: 900±20mm

PCB Size

50mmx50mm`330mmx250mm

PCB Thickness

0.3mm~3mm

Max PCB Warp

<2mm

X,Y Platform

Motion

Servo Motor Control

Position Accuracy

<1μm

Speed

700mm/s

Inspection

Camera

Digital High Speed CCD 5M Pix

Light

Ring R/G/B LED and White LED

FOV

32mm*32mm(20μm)

Speed Per FOV

<0.6s

Detect

Solder/Red gum: Volume,Area,Height,


Shape,Shift,Bridge,Overflow

Height Range

10~400um

Area Range

0.15mm×0.15mm~10mm×10mm

Height Accuracy on a Certificated Target

1μm

Height/Area/Volume Repeatability on a Certificated Target

<1μm@3sigma

GR&R

<10%

Software

OS

Windows 7

Vision

Spec.

Dual 3D Projection(Single optional)avoid shadow and reflection

UI

Result

GUI/Easy use,support English/Chinese/Big5

MARK

2D/3D true color


2 Marks/Board or 2 Marks/Array, support bad mark

Program

Gerber 274D/X,CAD,Offline program,Bare Board Teach

SPC

Offline SPC

Support

Chart

Histogram/Control/Compare chart

Any Time Chart

Export

Volume,Area,Height,Shift


Excel,Jpg,Bmp

 

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