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High Precision pick and place machine
Classification:SMT Pick and Place Machine
Model:SM471Plus
SMT Chip Counter Samsung 471 Plus Pick And Place Machine LED Making SMT IC Placement
High Precision pick and place machine SM471Plus Product Introduction:
As SAMSUNG SMT Pick and Place Machine that applies two gantries equipped with 10 spindles per head as well as new flying vision, the SAMSUNG SMT Pick and Place Machine realizes a chip mounting speed of 75,000 CPH, the highest in the world among chip shooters of the same class. In addition, it is applicable to 0402 chips to the largest 14mm ICs by default and increases actual productivity and placement quality by applying an electrically driven high speed and high precision feeder. Moreover, it is designed for mixed use with the SM pneumatically driven feeder to maximize the customers' operational convenience.
High Precision pick and place machine SM471 Plus Product Features:
1,Realizes a Super-high Speed Placement Speed of 75,000 CPH
Realizes the Highest Placement Speed Among Chip Shooters of the Same Class by Adopting a New Flying Head Mechanism Equipped With 10 Spindles.
2,Electrically Driven High Speed and High Precision Feeder
Electrically Driven SM Feeder
Allows integrated use of 0603/2P/4P Equipped with a function to automatically align the pickup position between feeders to improve the simultaneous pickup rate. Able to set various part supply speeds to improve the stability of part supply.
■ 75,000 CPH(Optimum)
■ 2 Gantry x 10 Spindles/Head
■ Applicable Parts : 0402 ~ 14mm(H 12mm)
■ Applicable PCB : Max. 510(L) x 460(W)(Standard)
Max. 610(L) x 460(W)(Option)
■ Electrically Driven High Speed and High Precision Feeder
Allows mixed use with an SM pneumatically driven feeder
■ SMART Feeder
The world's first feeder equipped with Auto Splicing and Auto Loading functions
High Precision pick and place machine SM471 Plus Specification:
Alignment | Flying Vision |
Number of Spindles | 10 Spindles x 2 Gantry |
Placement Speed | 75,000 CPH(Optimum) |
Placement Accuracy | ±50μm@μ+3σ (Based on the Standard Chips) |
Component Range | Chip 0402 ~ 14mm(H 12mm) IC, Connector(Lead Pitch 0.4mm) BGA, CSP(Ball Pitch 0.4mm) |
Board Dimension(mm) | 50(L) x 40(W)~510(L) x 460(W)610(L) x 460(W)(Option) |
Feeder Capacity | 120ea / 112ea(Docking Cart) (Based on 8mm) |
Power | AC200 / 208 / 220 / 240 / 380 / 415V (50/60Hz, 3Phase)Max. 5.0kVA |
Air Consumption | 0.5 ~ 0.7MPa(5 ~ 7kgf/cm2) |
Mass | Approx. 1,820kg |
External Dimension(mm) | 1,650(L) x 1,690(D) x 1,485(H) |
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