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SMT vacuum reflow oven VS traditional SMT reflow oven in advantages of use

  • Time:2019-08-28
  • Visits:338

SMT vacuum reflow oven VS  traditional SMT reflow oven in advantages of use


The times are developing, technology is constantly updating, and the most prominent performance is undoubtedly electronic products. In order to cater to market trends, many related manufacturing equipment are also constantly being reformed. And SMT vacuum reflow oven emerged in this situation. SMT vacuum reflow oven, also known as vacuum reflow soldering. High quality soldering of products is carried out in a vacuum environment. During the heating or cooling process, reducing systems (N2, formic acid, N2H2, H2) are introduced to protect the product and solder from oxidation. At the same time, the oxide on the surface of the product and solder is reacted to improve the quality of the soldering surface and reduce the porosity of the soldering. 


In contrast, SMT vacuum reflow oven can exert more advantages than traditional SMT reflow oven. The following are the specific advantages that SMT vacuum reflow oven can demonstrate in production applications.


1. Significantly reduce the number of voids in solder, and the area of voids combined with solder can reach less than 1%. Improve product electrical characteristics and combine performance.

2. The upper and lower hot air circulation heating method, double-sided board soldering can also greatly reduce voids through a single vacuum reflow soldering, and can be used to solder circuit boards with aluminum heat sinks installed.

3. SMT vacuum reflow oven adopts the principle of infrared radiation heating, which has the characteristics of uniform temperature, ultra-low temperature safe soldering, no temperature difference, no overheating, reliable and stable process parameters, no need for complex process tests, and low environmental cost operation. It meets the needs of multiple product varieties, small batches, and high reliability soldering under vacuum conditions.

4. SMT vacuum reflow oven utilizes the changing vacuum degree to gradually move large bubbles to the outer edge of the solder pad, preventing solder joint splashing. During soldering and vacuum treatment, the assembled parts are fixed in a sealed treatment chamber. The traditional system using vertical grooves requires the circuit board to be vertically transported onto it during the liquid phase, forming a sealed chamber, and then subjected to vacuum treatment. This soldering system precisely has a good advantage in product quality. Under these conditions, SMT vacuum reflow oven can efficiently discharge the bubbles generated by the volatilization of flux in the solder, effectively reducing the porosity of the soldering surface of the product and improving the soldering quality of the product.

5. From the perspective of soldering defect rate, using this soldering technology can greatly reduce the soldering defect rate, reduce material loss, and damage to the soldering object. We all know that for precision electronic instruments, any soldering error that occurs can lead to program confusion and even equipment malfunction. So, SMT vacuum reflow oven technology of reflow oven soldering is very necessary and cannot be replaced.