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SMT reflow soldering function and technical characteristics

  • Time:2019-08-21
  • Visits:342

SMT reflow soldering function and technical characteristics


SMT reflow soldering is the most important process technology in SMT, and the quality of SMT reflow soldering is the key to the reliability of SMA. It directly affects the performance reliability and economic benefits of electronic equipment, and the welding quality depends on the welding method, welding material, welding process technology, and welding equipment used. 


1.What is SMT reflow soldering

SMT reflow soldering is one of the three main processes in SMT mounting technology. SMT reflow soldering is mainly used to weld circuit boards that have already been installed with components. By heating, the solder paste is melted to fuse and weld the SMT components with the circuit board solder pads. Then, through the cooling of SMT reflow soldering, the solder paste is cooled to solidify the components and solder pads together. However, most people understand it as a SMT reflow soldering machine, which is a machine that completes the welding of components on PCB boards through SMT reflow soldering. It is currently a widely used application, and most electronic factories will use it. To understand SMT reflow soldering, you need to first understand the SMT process, which is more commonly known as welding. However, during the soldering process, SMT reflow soldering provides a reasonable temperature, that is, the furnace temperature curve.


2.The function of SMT reflow soldering

The function of SMT reflow soldering is to send the installed circuit board of SMT components into the SMT SMT reflow soldering chamber. After high temperature, the solder paste used to solder the SMT components is melted through a process of reflow temperature change through high-temperature hot air, allowing the SMT components to combine with the solder pads on the circuit board, and then cooled together.


3.The characteristics of SMT reflow soldering technology

(1)The thermal shock to the components is small, but sometimes it can cause significant thermal stress to the components.

(2)Apply solder paste only to the required areas, which can control the amount of solder paste applied and avoid defects such as bridging.

(3)The surface tension of the molten solder can correct small deviations in the placement position of the component components.

(4)Local heating sources can be used to weld different welding processes on the same substrate.

(5)Impurities are generally not mixed in the solder. When using solder paste, it can correctly maintain the composition of the solder.